X0205MA 1BA2

X02 Datasheet 1.25 A sensitive gate SCR Features A G K • On-state rms current, IT(RMS) 1.25 A • Repetitive peak off-state voltage, VDRM/VRRM 600 or 800 V • Triggering gate current, IGT (Q1) 50 to 200 µA A Applications K A G K G A SOT-223 TO-92 A K • • • Ground fault circuit interrupters Overvoltage crowbar protection in power supplies Capacitive ignition circuits Description The X02 SCR can be used as the on/off function in applications where topology does not offer high current for gate triggering. G SMBflat-3L This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. Product status link X02 Product summary IT(RMS) 1.25 A VDRM/VRRM 600, 800 V IGTstandard 50 to 200 µA DS2122 - Rev 6 - July 2023 For further information contact your local STMicroelectronics sales office. www.st.com X02 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, TJ = 25 °C unless otherwise specified) Symbol Parameters SOT-223 IT(RMS) IT(AV) ITSM I2t dl/dt IGM PG(AV) Tstg Tj RMS on-state current (180 ° conduction angle) Average on-state current (180 ° conduction angle) TO-92 Unit 1.25 A 0.8 A Ttab = 99 °C TL = 63 °C SMBflat-3L Ttab = 111 °C SOT-223 Ttab = 99 °C TO-92 Value TL = 63 °C SMBflat-3L Ttab = 111 °C F = 50 Hz tp = 8.3 ms 25 F = 60 Hz tp = 10 ms 22.5 tp = 10 ms Tj = 25 °C 2.5 A2s F = 60 Hz Tj = 125 °C 50 A/µs tp = 20 µs Tj = 125 °C 1.2 A Tj = 125 °C 0.2 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +125 °C Non repetitive surge peak on-state current I2t value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation A Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Value Parameters Symbol IGT(1) X020 5 X0202 Min. VD = 12 V, RL = 140 Ω VGT Max. 20 200 50 Unit µA Max. 0.8 V V VGD VD = VDRM, RL = 3.3 kΩ, RGK = 1 kΩ, Tj = 125 °C Min. 0.1 VRG IRG = 10 μA Min. 8 IH(2) IT = 50 mA, RGK = 1 kΩ Max. 5 mA IL IG = 1 mA, RGK = 1 kΩ Max. 6 mA VD = 67 % VDRM, RGK = 1 kΩ, Tj = 110 °C Min. dV/dt(2) 10 15 V/µs 1. Minimum IGT is guaranteed at 5 % of IGT max. 2. For both polarities of A2 referenced to A1 DS2122 - Rev 6 page 2/14 X02 Characteristics Table 3. Static electrical characteristics Symbol (1) VT VTO(1) Rd IDRM IRRM Test conditions ITM = 2.5 A, tp = 380 µs Value Unit Tj = 25 °C Max. 1.45 V Threshold on-state voltage Tj =125 °C Max. 0.9 V Dynamic resistance Tj =125 °C Max. 200 mΩ 5 µA 500 µA Max. value Unit Tj =25 °C VDRM = VRRM Tj =125 °C Max. 1. For both polarities of A2 referenced to A1 Table 4. Thermal resistance Symbol Parameters Rth(j-t) Junction to tab (AC) Rth(j-l) Junction to lead (AC) Rth(j-a) Junction to ambient (S(1) = 5 cm²) Junction to ambient SOT-223 25 SMBflat-3L 14 TO-92 60 SOT-223 60 SMBflat-3L 75 TO-92 150 °C/W 1. Copper surface under tab. DS2122 - Rev 6 page 3/14 X02 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum power dissipation versus on-state RMS current (full cycle) Figure 3. Average and DC on-state current versus ambient temperature Figure 5. Relative variation of triggering, holding and latching current versus junction temperature DS2122 - Rev 6 Figure 2. Average and DC on-state current versus tab (SOT-223, SMBflat-3L) or lead (TO-92) temperature Figure 4. Relative variation of thermal impedance versus pulse duration Figure 6. Relative variation of holding current versus gate-cathode resistance (typical values) page 4/14 X02 Characteristics (curves) Figure 7. Relative variation of dV/dt immunity versus gate- Figure 8. Relative variation of dV/dt immunity versus gatecathode resistance (typical values) cathode capacitance (typical values) Figure 9. Surge peak on-state current versus number of cycles Figure 10. On-state characteristics (maximum values) Figure 11. On-state characteristics (maximum values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (SOT-223, SMBflat-3L) DS2122 - Rev 6 page 5/14 X02 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SOT-223 package information • • Epoxy meets UL94, V0 Lead free plating + halogen-free molding resin Figure 13. SOT-223 package outline V A A1 c B e1 D B1 4 H E 1 2 3 e DS2122 - Rev 6 page 6/14 X02 SOT-223 package information Table 5. SOT-223 package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. A Max. Min. Typ. 1.80 A1 0.02 0.10 Max. 0.0709 0.0008 0.0039 B 0.60 0.70 0.85 0.024 0.0276 0.0335 B1 2.90 3.00 3.15 0.114 0.1181 0.1240 c 0.24 0.26 0.35 0.009 0.0102 0.0138 D 6.30 6.50 6.70 0.248 0.2559 0.2638 e 2.3 0.0906 e1 4.6 0.1811 E 3.30 3.50 3.70 0.130 0.1378 0.1457 H 6.70 7.00 7.30 0.264 0.2756 0.2874 V 10° max. 1. Inches only for reference Figure 14. SOT-223 footprint (dimensions in mm) 3.25 1.32 5.16 7.80 1.32 2.30 DS2122 - Rev 6 0.95 page 7/14 X02 TO-92 package information 2.2 TO-92 package information • • Lead free plating + halogen-free molding resin Epoxy meets UL94, V0 Figure 15. TO-92 package outline c A a B C b D F E Table 6. TO-92 package mechanical data Dimensions Inches(1) Millimeters Ref. Min. A Typ. Max. Min. 1.35 B Typ. 0.0531 4.70 C Max. 0.1850 2.54 0.1000 D 4.40 0.1732 E 12.70 0.5000 F 3.70 0.1457 a 0.50 0.0197 b 1.27 c 0.0500 0.48 0.0189 1. Inches dimensions given for information DS2122 - Rev 6 page 8/14 X02 SMBflat-3L package information 2.3 SMBflat-3L package information • • Epoxy meets UL94, V0 Lead-free package Figure 16. SMBflat-3L package outline Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions in the following table are guaranteed. Table 7. SMBflat-3L mechanical data Dimensions Millimeters Ref. Min. DS2122 - Rev 6 Typ. Inches (dimensions are for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.0354 0.0433 b 0.35 0.65 0.0138 0.0256 b1 1.95 2.20 0.0768 0.0866 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1555 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 L2 0.60 0.0236 e 1.60 0.0630 page 9/14 X02 SMBflat-3L package information Figure 17. Footprint recommendations, dimensions in mm (inches) 5.84 (0.230) 0.51 (0.020) 2.07 (0.082) 2.07 (0.082) 0.51 (0.020) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) mi lli met ers (inc hes ) Note: DS2122 - Rev 6 This drawing may not be in scale; however, all the specified dimensions are guaranteed. page 10/14 X02 Ordering information 3 Ordering information Figure 18. Ordering information scheme X 02 02 M [BLANK] 1BA2 Sensitive SCR series Current 02 = 1.25 A Sensitivity 02 = 200 µA 05 = 50 µA Voltage M = 600 V N = 800 V Package A = TO-92 N = SOT-223 UF = SMBflat-3L Packing mode 1BA2 = TO-92 bulk 2BL2 = TO-92 ammopack 5BA4 = SOT-223 tape and reel 7” Blank = SMBflat-3L tape and reel 13” Table 8. Ordering information DS2122 - Rev 6 Order code Marking X0202MA 1BA2 X0202 MA X0202MA 2BL2 X0202 MA X0202MN5BA4 X2M X0202NA 1BA2 X0202 NA X0202NA 2BL2 X0202 NA X0202NN5BA4 X2N X0205MA 1BA2 X0205 MA X0205MA 2BL2 X0205 MA X0205NA 1BA2 X0205 NA X0202NUF X2N Package Weight TO-92 0.2 g SOT-223 0.12 g TO-92 0.2 g SOT-223 0.12 g TO-92 SMBflat-3L 0.2 g 47 mg Base qty. Delivery mode 2500 Bulk 2000 Ammopack 1000 Tape and reel 2500 Bulk 2000 Ammopack 1000 Tape and reel 2500 Bulk 2000 Ammopack 2500 Bulk 5000 Tape and reel page 11/14 X02 Ordering information Table 9. Product selector Part number 600 800 Sensitivity µA Package X0202MA X 200 TO-92 X0202MN X 200 SOT-323 X0202NA X 200 TO-92 X0202NN X 200 SOT-323 50 TO-92 X0205MA DS2122 - Rev 6 Voltage (xxx) X X0205NA X 50 TO-92 X0202NUF X 200 SMBflat-3L page 12/14 X02 Revision history Table 10. Document revision history DS2122 - Rev 6 Date Revision Changes Sep-2000 3 Previous issue 14-Jan-2011 4 Added SMBflat-3L package and ECOPACK statement. 17-Apr-2023 5 Updated Figure 16 and Table 7. Minor text changes. 19-Jul-2023 6 Updated Table 8. page 13/14 X02 IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2023 STMicroelectronics – All rights reserved DS2122 - Rev 6 page 14/14